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Thanks to the development of small spacing led, cob, IMD, SMD and other technologies have been prosperous and developed in recent years, and are moving towards the forefront of the world step by step. In the growing micro spacing display market below P1.0, cob is one of the core technical routes, and it is differentiated into formal and flip. Flip cob has a broader imagination space because it can truly realize the chip level gap!
Micro spacing of LED display has become an important trend in the development of display industry. In recent years, cob has entered an explosive period, and more and more manufacturers have joined the cob camp. What is cob? Why is flip cob popular?
What is cob?
Cob (chip on board) technology originated in the 1960s. It is an "electrical design" committed to simplifying the packaging structure of ultra-fine electronic components and improving the stability of final products. In short, the structure of cob packaging is to directly paste and weld the most original and bare chips or electronic components on the circuit board and cover it with special resin.
Full flip cob advantage
Ultra high reliability
The thickness of the packaging layer is further reduced, which can completely solve the stubborn problems of color lines and bright and dark lines between formal cob modules. The black field is darker, the brightness is brighter and the contrast is higher. Support HDR Digital image technology, fine and perfect static and high dynamic image quality.
Simplified process display better
As an upgraded product of formal cob, full flip cob further improves the reliability based on the advantages of ultra-small dot spacing, high reliability and non dazzling surface light source of formal cob, simplifies the production process, better display effect, perfect near screen experience, and can realize the real chip level spacing.
Large size and wide field of view
2K / 4K / 8K resolution unlimited size free splicing, suitable for large scene display. It has good visual angle and side view display uniformity, no color deviation under large viewing angle, and can achieve the viewing effect of 170 degrees.
Ultra high density and smaller dot spacing
Full flip cob is a true chip level package without wiring. The physical space size is only limited by the size of light-emitting chip. It breaks through the point spacing limit of formal chip and is the first choice for products with a point spacing of less than 1.0.
Energy saving and comfortable, good near screen experience
Full flip chip reduces power consumption by 45% under the same brightness. Unique heat dissipation technology, under the same brightness, the surface temperature of the screen is 10 ℃ lower than that of the conventional formal chip LED display, which is more suitable for the application scene of near screen experience.
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