Under the new situation,China led display billboard packaging industry development direction

When it comes to LED packaging, this is the main breakthrough for Chinese enterprises to enter the LED industry at the beginning of the rise of China's LED industry.>LED industry in China started late, grip in LED core technology by international companies, under the condition of the upstream chip end is difficult to step in, Chinese enterprises have to choose technical difficulties is not very high, relatively low entry barriers of encapsulation, and up to the downstream extension to expand.Today, China's LED packaging has reached the international first-class level.LED packaging is no longer a simple assembly link, but a test of the production process and technology level. For LED display billboard, the packaging of LED devices accounts for 30% to 70% of the total cost, and the packaging quality is directly related to the quality of LED display.For a long time, the progress of packaging technology of LED display devices has promoted the development of LED display devices.With the development of LED display towards hd display, the technology and technology of LED display device packaging are more and more demanding. LED display billboard device packaging technology development process To understand the current development status and future trend of LED packaging industry, we first need to review the development process of China's packaging industry.The LED industry in China started in the 1980s, and the development of LED display packaging devices mainly experienced several stages, such as lattice module, lamp, sub-surface mount and SMD.At present, dot matrix module and sub - label packaging have been eliminated by the market, direct - insert packaging is mainly used in the outdoor market with large space above P10, others have been replaced by table stickers.With the continuous development of LED display market with small space, more and more display companies now turn their attention to COB packaging.At the same time, Micro LED packaging technology has also been widely discussed in the industry with the emergence of a new generation of display technology that is seen as potentially disruptive to the industry.Let's take a look at the technical features of each of these packaging forms. 1. Lamp package After dot matrix module of plug-in package, its technical principle is to use lead frame for various packaging shaped pin, one end of the bracket is usually "bowl shape" structure "stick LED chip bonding fixed within the" cup "structure, by filling in the form of, again to LED molding die cavity injection liquid epoxy resin, and then insert the bonding good pin type LED bracket, high-temperature barbecue make epoxy resin curing, finally from the mould. Direct plug-in can be said to be the first developed and plenty of LED products on the market, wide variety, mature technology, its simple manufacturing process, low cost, packaging before SMD appeared so upright type, have very high market share.Directly inserted LED packaging products, mainly used for outdoor large screen, with high brightness, high reliability, strong environmental adaptability and other advantages. At present, due to the outdoor point spacing also toward the density direction, limited into the red, green and blue three devices instrumentation alone, unable to realize high density, so the outdoor P10 below point spacing gradually replaced by a table stick LED device.It is generally believed that the outdoor direct plug-in LED display is divided by P10, but there are also direct plug-in LED packaging products applied to P9 in the industry. 2. SMD packaging Table stick (SMD) packaging is to single or multiple LED chip bonding with plastic "cup" on the casing outside the metal stent (irfpa bracket foot respectively connected the LED chip of P, N), then the plastic outer box or organic silicone potting liquid epoxy resin, and then high temperature baking forming, finally to separate packaging components into a single table.Because surface mount technology (SMT) can be adopted, the degree of automation is high.Using table encapsulation device display, in color reproduction, color consistency, evenness, perspective, the overall effect, especially in terms of volume, has incomparable advantages into the screen.But also there is congenitally deficient, SMDLED failure rates and the attenuation rate is higher, the ability to adapt to bad environment is relatively poor. At present, SMD led are mainly divided into TOP and Chip led.The former usually USES PLCC(LeadedChip Carrier) support, while the latter USES PCB circuit board as the Carrier of LED chip.PLCC stands have low cost, but there are some problems in application, such as poor air tightness, poor heat dissipation, uneven luminescence and low luminous efficiency.Although there are PCT and EMC scaffolds with better performance and light efficiency, they are not widely used in the industry due to their high price and high cost. 3. COB packaging COB(chip On board) packaging, is a kind of bare chip with conductive or non-conductive adhesive attached to the interconnection basic, and then conduct lead bonding to achieve its electrical connection.COB encapsulation is no stent technology, without the support of welding PIN feet, each lamp bead and welding wire are epoxy resin colloid closely within the colloid, no bare elements. Compared with SMD packaging display, COB screen USES is integrated packaging technology, due to save the single LED devices patch again after the encapsulation process, can effectively solve the SMD package display, harder because of shrinking face point spacing technology, low yield and higher costs.However, COB packaging has not been widely popularized in the display industry in recent years because it integrates upstream chip technology, mid-stream packaging technology and downstream display technology.To achieve large-scale application of COB encapsulation, close cooperation from upstream, middle and downstream enterprises is required. 4. Micro LED packaging Micro leds are called "Micro Light Emitting diodes" in English. They are also called "Micro Light Emitting diodes" in Chinese. Micro LED the LED, miniaturization and array of thin film structure, its size is about the size of the mainstream of LED 1%, each 1 pixels can be addressed, individual drive, the pixel spacing by millimeter level down to micron level, thus theory more than 1500 ppi even 2000 ppi ultra-high resolution. Inherited Micro LED LED low power consumption, high brightness, high resolution, color saturation, fast response speed, super energy saving, long life, high efficiency advantages, its power consumption is about 10% of the 10% of the LCD, OLED.As a result, micro led are seen as a potential game-changer for a new generation of display technology.